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target specification this is preliminary information on a new product foreseen to be developed. details are subject to change without notice. april 2009 rev 1 1/32 1 TDA7703 highly integrated tuner for am/fm car radio features fully integrated vco for world tuning am/fm mixers with hi gh image rejection integrated am-lna and am-pindiode automatic self alignmen t for image rejection digital if signal processing, high performance and drift-free integrated if-filters with high selectivity, high dynamic range and fm adaptive bandwidth control high performance stereodecoder with noiseblanker i 2 c bus controlled single 5 v supply lqfp44 package description the TDA7703 highly integrated tuner (hit44) is part of a family of tuners for carradio applications. it contains mixers and if amplifiers for am and fm, fully integrated vco and pll synthesizer, if-processing includin g adaptive bandwidth control (fm), stereo decoder on a single chip. the utilization of digital si gnal processing results in numerous advantages against today's tuners: ? very low number of external components ? very small space occupation and easy application ? very high selectivity due to digital filters ? high flexibility by software control ? automatic image rejection alignment. lqfp44 table 1. device summary order code package packing TDA7703 lqfp44 (10x10x1.4mm) tray TDA7703tr lqfp44 (10x10x1.4mm) tape and reel www.st.com
contents TDA7703 2/32 rev 1 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 function description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 fm - mixer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2 fm - agc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 am - lna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 am - agc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.5 am - mixer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6 if a/d converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 audio d/a converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.8 vco . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.9 pll . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.10 crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.11 dsp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.12 io interface pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.13 serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.3 general key parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.4 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.4.1 fm - section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.4.2 am - section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.4.3 vco . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.4.4 phase locked loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.4.5 audio dac . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.4.6 io interface pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.4.7 i 2 c interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.5 overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
TDA7703 contents rev 1 3/32 3.5.1 fm overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.5.2 am mw overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.5.3 am lw overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4 front-end processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5 weak signal processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.1 fm if-processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.1.1 dynamic channel selection filter (diss) . . . . . . . . . . . . . . . . . . . . . . . . 24 5.1.2 soft mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.1.3 adjacent channel mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.1.4 stereo blend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.1.5 high cut control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.1.6 stereo decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.2 am if-processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.2.1 channel selection filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.2.2 soft mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.2.3 high cut control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 6 application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 8 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
list of tables TDA7703 4/32 rev 1 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 3. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 4. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 5. general key parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 6. fm - section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 7. am - section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 8. vco . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 9. phase locked loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 10. audio dac . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 11. io interface pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 12. i 2 c interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 13. fm overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 table 14. am mw overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 15. am lw overall system performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 16. register 0x00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 17. register 0x01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 18. register 0x02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 19. dynamic channel selection filter (diss) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 table 20. soft mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 21. adjacent channel mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 22. stereo blend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 23. high cut control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table 24. de-emphasis filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 25. stereo decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 26. channel selection filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 27. soft mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 28. high cut control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 table 29. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
TDA7703 list of figures rev 1 5/32 list of figures figure 1. functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 2. pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 3. i 2 c "write" sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 figure 4. i 2 c "read" sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 5. i 2 c bus timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 6. fm input set-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 7. am mw input set up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 8. am lw input set-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 9. typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 figure 10. lqfp44 (10x10x1.4mm) mechanical data and package dimensions. . . . . . . . . . . . . . . . . 30
block diagram and pin description TDA7703 6/32 rev 1 1 block diagram and pin description 1.1 block diagram figure 1. functional block diagram fm : 8 fref vco pll : n agc adc adc supply osc audio out sum nco dll dsp agc am i 2 c stereo dac
TDA7703 block diagram and pin description rev 1 7/32 1.2 pin description figure 2. pin connection (top view) table 2. pin description pin # pin name description 1 lf1 pll loopfilter output 2 tcagcfm fm agc time constant 3 fmmixdec fm mixer decoupling 4 fmixin fm mixer input 5 gnd-rf rf ground 6 fmpindrv fm agc pin diode driver 7 vcc-rf 5 v supply for rf section 8 tcam am agc time constant 9 pinddec am agc internal pin diode decoupling 10 pindin am agc internal pin diode input 11 gnd-lna gnd of am lna, am internal pin diode , am mixer, if 12 lnain am lna input 13 lnadec am lna decoupling 14 lnaout am lna output first stage 1 2 3 4 5 6 7 8 9 10 11 vcc-dac gnd-1v2 vdd-1v2 rstn busset vdd-1v2 scl sda vdd-3v3 reg-1v2 vccreg1v2 lf1 tcagcfm fmmixdec fmmixin gnd-rf fmpindrv vcc-rf tcam pinddec pindin gnd-lna gnd-vco vcc-vco gnd-pll vcc-pll vcc-ifadc gnd-ifadc dacoutr dacoutl gnd-dac oscin oscout lnain lnadec lnaout lnain2 lnaout2 lnadec2 ammixin vref165 vrefdec gnd-dig vcc-dig lqfp44 12 13 14 15 16 17 18 19 20 21 22 33 32 31 30 29 28 27 26 25 24 23 44 43 42 41 40 39 38 37 36 35 34
block diagram and pin description TDA7703 8/32 rev 1 15 lnain2 am lna input 2 nd stage 16 lnaout2 am lna output 17 lnadec2 am lna decoupling 2nd stage 18 ammixin am mixer input 19 vref165 1.65 v reference voltage decoupling 20 vrefdec 3.3 v reference voltage decoupling 21 gnd-dig digital gnd 22 vcc-dig 5 v supply for digital logic 23 vccreg1v2 vcc of 1.2 v regulator 24 reg1v2 1.2 v regulator output 25 vdd-3v3 3.3 v vdd output / decoupling 26 sda i 2 c bus data 27 scl i 2 c bus clock 28 vdd-1v2 1.2 v dsp supply 29 busset bus communication setup 30 rstn reset pin (active low) 31 vdd-1v2 1.2 v dsp supply 32 gnd-1v2 digital gnd for 1.2 v vdd 33 vcc-dac 5 v supply of audio dac 34 oscout xtal osc output 35 oscin xtal osc input 36 gnd-dac audio dac gnd 37 dacoutl audio output left 38 dacoutr audio output right 39 gnd-ifadc if adc gnd 40 vcc-ifadc 5 v supply of if adc 41 vcc-pll 5 v supply of pll 42 gnd-pll pll gnd 43 vcc-vco 5 v supply of vco 44 gnd-vco vco gnd table 2. pin description (continued) pin # pin name description
TDA7703 function description rev 1 9/32 2 function description 2.1 fm - mixer the fm image-rejection mixer is optimized for best performance with a passive wide-band prestage. the input frequency is downconverted to low if with high image rejection. 2.2 fm - agc the programmable rfagc senses the mixer in put whereas the ifagc senses the ifadc input to avoid overload. the pin diode driver is able to drive external pin diodes with a current value as high as 15ma. the time constant of the fm-agc is defined by an external capacitor. 2.3 am - lna the am-lna is integrated with low noise and high iip2 and iip3. the gain of the lna is controlled by the agc. the maximum gain is set with an external resistor, typically 28 db with 1.5 k . 2.4 am - agc the programmable am-rf-agc senses the mixer inputs and controls the internal pin diode and lna gain. first the lna gain is reduced by about 10db, then the pin diodes are activated to attenuate the signal. the time constant of the am-agc is defined with an external capacitor and programmable internal currents. 2.5 am - mixer the am mixer converts rf to low if with high image rejection. 2.6 if a/d converters a high performance iq-ifadc converts the if-signal to digital if for subsequent digital signal processing.
function description TDA7703 10/32 rev 1 2.7 audio d/a converters a stereo dac provides the left / right audio signals after if-processing and stereodecoding by the dsp. 2.8 vco the vco is fully integrated without any external tuning component. it covers all fm frequency bands including eu, us, japan, easteu and am-bands including lw and mw. 2.9 pll the high speed tuning pll is able to settle within about 300 s. the frequency step can be as low as 5 khz in fm and 500 hz in am. 2.10 crystal oscillator the device works with a 37.05 mhz fundamental tone crystal, and can be used also with a 3 rd overtone 37.05 mhz crystal. 2.11 dsp the dsp and its hardware accelerators perform all the digital signal processing. the main program is fixed in rom. control parameters are copied in ram and are accessible and modifiable there, thus allowing parametric performance optimization. it performs: digital down-conversion of if bandwidth selection with va riable controlled bandwidth fm noiseblanking fm/am demodulation with softmute, high-cut, weak signal processing and quality detection fm stereo decoding with stereo blend
TDA7703 function description rev 1 11/32 2.12 io interface pins the TDA7703 has the following io pins: all the inputs are voltage-tolerant up to 3.5 v . the outputs can drive currents up to 0.5 ma from the internal 3.3 v supply line. 2.13 serial interface the device is controlled with a standard i 2 c bus interface. through the serial bus the processing parame ters can be modifed and the signal quality parameters can be read out. the operation of the device is handled through high level commands sent by the main car- radio p through the serial interface, which allow to simplify the operations carried out in the main p. the high level commands include among others: set frequency (which allows to avoid computing the pll divider factors); start seek (the seek operation can be carried out by the TDA7703 in a completely autonomous fashion). the serial bus communication configuration is set by forc ing pin 29 (busset) to ground when the rstn line transitions from low to high (when rstn is low, the ic is in reset mode). the voltage level forced to pin 29 must be released to start the system operation a suitable time after the rstn line has gone high. the i 2 c address is 0xc2 (write) / 0xc3 (read). the status of pin 29 during the reset phase can be set to low by not forcing any voltage on it from outside, as a 50 k internal pull-down resistors is present. to make sure the boot mode is correctly latched up at start-up, it is advisable to keep the rstn line low until the ic supply pins have reached their steady state, and then for an additional time t reset (see section 3.4.6 ). i 2 c requires two signals: clock (scl) and data (sda - bidirectional). the protocol requires an acknowledge after any 8-bit transmission. a "write" communication example is shown in the figure below, for an unspecified number of data bytes (see communication protocol manual for frame structure description): figure 3. i 2 c "write" sequence sda pin 26 serial communication with p scl pin 27 serial communication with p busset pin 29 serial communication with p rstn pin 30 reset pin driven by p ack data stop clk1 clk2 ? clk8 clk9 clk1 clk2 start ack d7 d6 address a0 ? d0 ? clk8 clk9 a7 a6 ? scl sda
function description TDA7703 12/32 rev 1 the sequence consists of the following phases: start: sda line transitioning from h to l with scl fixed h. this signifies a new transmission is starting; data latching: on the rising scl edge. the sda line can transition only when scl is low (otherwise its transitions are interpreted as either a start or a stop transition); acknowledge: on the 9 th scl pulse the p keeps the sda line h, and the TDA7703 pulls it down if communication has been successful. lack of the acknowledge pulse generation from the TDA7703 means that the communication has failed; a chip address byte must be sent at the beginning of the transmission. the value is c2 for "write"; as many data bytes as needed can follow the address before the communication is terminated. see the next section for details on the frame format; stop: sda line transitioning from l to h with scl h. this signifies the end of the transmission. red lines represent transmissions from the TDA7703 to the p. a "read" communication example is shown in the figure below, for an unspecified number of data bytes (see later on for frame structure decription): figure 4. i 2 c "read" sequence the sequence is very similar to the "write" one and has the same constraints for start, stop, data latching. the differences follow: a chip address must always be sent by the p to the TDA7703; the address must be c3; a header is transmitted after the chip address (the same happens for "write") before data are transferred from the TDA7703 to the p. see the communication protocol manual for details on the frame format; when data are transmitted from the TDA7703 to the p, the p keeps the sda line h; the acknowledge pulse is generated by the p for those data bytes that are sent by the TDA7703 to the p. failure of the p to generate an ack pulse on the 9 th clk pulse has the same effect on the TDA7703 as a stop. the max. clock speed is 500 kbit/s. sda a7 a6 ? a0 d7 d6 ? d0 scl clk1 clk2 ? clk8 clk9 clk1 clk2 ? clk8 clk9 start address ack data ack stop
TDA7703 electrical specifications rev 1 13/32 3 electrical specifications 3.1 absolute maximum ratings 3.2 thermal data 3.3 general key parameters table 3. absolute maximum ratings symbol parameter test condition min typ max units v cc supply voltage 5.5 v t stg storage temperature -55 150 c table 4. thermal data symbol parameter test condition value units r th j-case thermal resistance junction to case lqfp44 10x10, double-layer jedec pcb 55 c/w table 5. general key parameters symbol parameter test condition min typ max units v cc 5 v supply voltage 4.7 5 5.25 v i cc supply current @ 5 v 220 295 ma t amb ambient temperature range -30 75 c v vccreg12 vccreg12 supply voltage see note (1) 2v v 1v2 digital core 1.2v supply voltage when supplied externally see note (2) 1.08 1.2 1.32 v i 1v2 digital core 1.2 v supply current v 1v2 = 1.08 v see note (2) 120 ma v 1v2 = 1.2 v see note (2) 80 135 ma v 1v2 = 1.32 v see note (2) 150 ma 1. in the typical application supplied from 5v with a series resistor. 2. when the 1.2 v supply is applied externally , and not using the internal 1.2 v regulator.
electrical specifications TDA7703 14/32 rev 1 3.4 electrical characteristics v cc = 5 v; t amb = 27 c; unless otherwise specified. 3.4.1 fm - section table 6. fm - section symbol parameter test condition min typ max units fm imr mixer r in input resistance 90 130 170 k iip3 3 rd order intercept point up to v in/tone = 85 dbv 121 dbv fm agc rfagc-thr rfagc threshold, referred to mixer input; rf level min setting 85 dbv max setting 91 threshold steps 2 db threshold error -1.5 1.5 db threshold temperature drift 0.016 db/k ifagc-thr ifagc threshold, referred to mixer input; at tuned frequency rf level min setting 77 dbv max setting 81 threshold steps 2 db threshold error -1.5 1.5 db threshold temperature drift 0.016 db/k pin diode source current see note (1) 12 ma pin diode sink current 3 20 a pin diode source current in constant current mode see note (1) 0.4 ma 1. the current is generated by a ptat (proportional to abso lute temperature) source, and has therefore a temperature dependency described by: i/io = t/to, with io being the current at ambient temperature (25 c) and to the ambient temperature (25c) expressed in kelvin, that is 298 k.
TDA7703 electrical specifications rev 1 15/32 3.4.2 am - section 3.4.3 vco table 7. am - section symbol parameter test condition min typ max units am imr mixer r in input resistance 20 30 45 k iip3 3 rd order intercept point up to v in/tone = 90 dbv 129 dbv iip2 2 nd order intercept point up to v in/tone = 90 dbv 158 dbv lo hsupp lo harmonic suppression n=2,3,4,5,6 100 db n=7,9 85 am lna gain voltage gain max gain, r ext = 1.5 k 24 28 31 db min gain (agc controlled) 12 r in input resistance 1000 k c in input capacitance 20 pf iip3 3 rd order intercept point @ maximum lna gain 125 dbv iip2 2 nd order intercept point @ maximum lna gain 143 dbv am pin diode iip2 2 nd order intercept point full attenuation, c source = 80 pf, f=1 mhz 140 dbv r min minimum resistance 50 80 c in input capacitance high ohmic 12 pf am agc agc-thr referred to mixer input rf level min setting 87 dbv max setting 93 thr-steps threshold steps 1 db threshold error -2.5 2.5 threshold temperature drift -3 3 table 8. vco symbol parameter test condition min typ max units f vco frequency range vco 1100 1550 mhz pn phase noise of lo locked vco; values referred @ 100mhz @ 100 hz @ 1 khz @ 10 khz -100 -115 -115 dbc/hz dev deviation error (rms) fm reception, deemphasis 50s, f audio =20hz...20khz 5hz
electrical specifications TDA7703 16/32 rev 1 3.4.4 phase locked loop 3.4.5 audio dac 3.4.6 io interface pins table 9. phase locked loop symbol parameter test condition min typ max units t settle settling time fm f < 10 khz 300 s fm step fm frequency step 5 khz am step am frequency step 500 hz table 10. audio dac symbol parameter test condition min typ max units v out output voltage am 90% modulation; fm 75 khz deviation. 400 hz audio frequency 300 mvrms bw bandwidth 1 db attenuation 15 khz r out output resistance 600 750 900 table 11. io interface pins symbol parameter test condition min typ max units high level output voltage i out = 500a 2.9 3.2 v low level output voltage i out = -1ma 0.1 0.3 v input voltage range 0 3.5 v high level input voltage 2.0 v low level input voltage 0.8 v t reset reset time minimum time during which pin rstn must be low so as to reset the device 10 s t latch boot mode configuration latch time minimum time during which the voltage applied at pin 29 must be kept in order to latch the correct boot mode (serial bus configuration) 10 s
TDA7703 electrical specifications rev 1 17/32 3.4.7 i 2 c interface the parameters of the following table are defined as in figure 5 . figure 5. i 2 c bus timing diagram table 12. i 2 c interface symbol parameter test condition min typ max units f scl scl clock frequency 500 khz t aa scl low to sda data valid 0.3 s t buf time the bus must be kept free before a new transmisison 1.3 s t hd-sta start condition hold time 0.6 s t low clock low period 1.3 s t high clock high period 0.6 s t su-sda start condition setup time 0.1 s t hd-dat data input hold time 0.3 0.9 s t su-dat data input setup time 0.1 s t r sda & scl rise time 0.3 s t f sda & scl fall time 0.3 s t su-stop stop condition setup time 0.6 s t dh data out time 0.3 s d95au378a t high t r t low t f scl sda in sda out t su-sta t hd-sda t hd-dat t su-dat t su-stop t buf t aa t dh
electrical specifications TDA7703 18/32 rev 1 3.5 overall system performance all measurements obtained with application of figure 9 unless otherwise specified. 3.5.1 fm overall system performance antenna level equivalence: 0 dbv = 1 v rms (antenna terminal voltage with 50 source). figure 6. fm input set-up input level referred to signal generator loaded with 50 (v rf , node 'a'); no antenna dummy; am input not connected. f rf = 98.1 mhz, v rf = 60 dbv, mono modulation, f dev = 40 khz, f audio = 1 khz. de-emphasis = 50 s. unless otherwise specified table 13. fm overall system performance parameter test condition min typ max units tuning range fm eu (can be modified by the user) 87.5 108 mhz tuning step fm eu 100 khz tuning range fm us 87.5 107.9 mhz tuning step fm us 200 khz tuning range fm jp 76 90 mhz tuning step fm jp 100 khz tuning range fm eeu 65 74 mhz tuning step fm eeu 100 khz sensitivity s/n =26db -3 0 dbv ultimate s/n @ 60 dbv, mono 72 75 db @ 60 dbv, deviation = 75 khz, mono 77 80 db @ 60 dbv, stereo 70 73 db distortion deviation= 75 khz 0.15 % max deviation thd=3% 120 khz adjacent channel selectivity (v u /v d ) f=100 khz, sinad=30 db desired 40 dbv, dev=40khz, 400hz undesired. dev=40khz, 1khz 13 db alternate channel selectivity (v u /v d ) f=200 khz, sinad=30 db desired 40 dbv, dev=40 khz, 400 hz undesired. dev=40khz, 1khz 62 db v rf + 6db pcb under test 50 v rf + 6db v rf 50 50 a
TDA7703 electrical specifications rev 1 19/32 max. strong signal interferer (v u /v d ) desired = 40 dbv sinad = 30db undesired f = 5mhz dev = 40khz, 1khz 75 db 3 signal performance (v u1 & v u2 /v d ) (1) desired = 40 dbv, dev=40khz, 400hz, sinad=30db undesired1 =400khz, dev=40khz, 1 khz undesired2=800khz, no mod 62 db desired = 40 dbv, dev=40khz, 400hz, sinad=30db undesired1 =1mhz, dev=40khz, 1 khz undesired2=2mhz, no mod 65 db am suppression m=30% 70 db image rejection 80 db logarithmic field strength indicator @40 dbv read ?fm_smeter_log? -0.33 (equiv. to 37 dbv) -0.3 -0.27 (equiv. to 43 dbv) - 1. signal levels referred to combiner output. table 13. fm overall system performance (continued) parameter test condition min typ max units
electrical specifications TDA7703 20/32 rev 1 3.5.2 am mw overal l system performance antenna level equivalence: 0 dbv = 1 v rms . figure 7. am mw input set up level referred to sg output before antenna dummy (v rf , node 'a'); capacitive dummy 15pf+68pf, fm input not connected. f rf = 999 khz (1000 khz for us), v rf =74 dbv, mod = 30%, f audio =400 hz, unless otherwise specified. table 14. am mw overall system performance parameter test condition min typ max units tuning range mw eu/jp (can be modified by the user) 531 1629 khz tuning step mw eu/jp (can be modified by the user) 9 khz tuning range mw us (can be modified by the user) 530 1710 khz tuning step mw us (can be modified by the user) 10 khz sensitivity s/n = 20 db 29 32 dbv ultimate s/n @ 80 dbv 63 66 db agc f.o.m. ref.=74 dbv -10db drop point 50 62 65 db distortion m = 80 % 0.1 % adjacent channel selectivity f=9 khz, v audio = -10 dbr (relative to f = 0 khz), m=30%, 1 khz 97 db alternate channel selectivity f=18 khz, v audio = -10 dbr (relative to f = 0 khz), m=30%, 1khz 97 db image rejection 80 db logarithmic field strength indicator @60 dbv read ?am_smeter_log? 0.50 (equiv. to 57 dbv) 0.47 0.43 (equiv. to 63 dbv) - pcb under test 30 v rf + 6db v rf 50 50 15pf 68pf a
TDA7703 electrical specifications rev 1 21/32 3.5.3 am lw overal l system performance antenna level equivalence: 0dbv = 1v rms figure 8. am lw input set-up level referred to sg output before antenna dummy (v rf , node 'a'); capacitive dummy 15pf+68pf; fm input not connected. f rf = 216 khz, v rf =74 dbv, mod = 30 %, f audio = 400 hz, unless otherwise specified. table 15. am lw overall system performance parameter test condition min typ max units tuning range lw (can be modified by the user) 144 288 khz tuning step lw (can be modified by the user) 1 khz sensitivity s/n =20db 31 34 dbv ultimate s/n @ 80 dbv 63 66 db agc f.o.m. ref.=74 dbv -10db drop point 50 62 65 db distortion m = 80 % 0.1 % image rejection 80 db pcb under test 30 v rf + 6db v rf 50 50 15pf 68pf a
front-end processing TDA7703 22/32 rev 1 4 front-end processing all the parameters in this sect ion refer to the programmability of the fe part of the device (registers). the part of the registers that are not described here have either fixed values or values written by the tuner drivers, and are described in the proper technical documentation (communication protocol manual). table 16. register 0x00 register number register definition msb lsb 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 am agc mode 0 lna and pin diode 1 pin diode only am agc time constant 0 0 slow (125 ms with 1 f) 0 1 medium (25 ms with 1 f) 1 1 fast (5 ms with 1 f) am agc threshold @ mixin 0 0 0 90 dbv 0 0 1 91 dbv 0 1 0 92 dbv 0 1 1 93 dbv 1 0 0 90 dbv 1 0 1 89 dbv 1 1 0 88 dbv 1 1 1 87 dbv am agc attack time constant 0 normal 1 fast
TDA7703 front-end processing rev 1 23/32 table 17. register 0x01 register number register definition msb lsb 23222120191817161514131211109876543210 fm mixer gain 0high 1low fm agc time constant 0 normal 1 fast fm agc output mode 00 normal 01 constant 15 ma 10 constant 1 ma table 18. register 0x02 register number register definition msb lsb 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 fm rf agc threshold @ mixin 0 0 87 dbv 0 1 89 dbv 1 0 91 dbv 1 1 93 dbv fm if agc threshold @ ifadc in 0 0 120 dbv 0 1 122 dbv 1 0 124 dbv
weak signal processing TDA7703 24/32 rev 1 5 weak signal processing all the parameters in this sect ion refer to the prog rammability of the dsp part of the device. the typical values are those set by default parameters (start-up without parametric change from main p); the max and th e min values refer to the pr ogrammability range. the values are referred to the typical application. wherever the possible values are a discrete set, all the possible programmable values are displayed. 5.1 fm if-processing 5.1.1 dynamic channel se lection filter (diss) 5.1.2 soft mute table 19. dynamic channel selection filter (diss) (discrete set) symbol parameter test condition min typ max units diss bw if filter #2 response: - 3db -80-khz if filter #1 - 60 - khz if filter #0 - 40 - khz table 20. soft mute (continuous set) symbol parameter test condition min typ max units smsp start point vs. field strength audio atten = 1 db read ?fm_softmute? no adjacent channel present 0 6 20 dbv smep end point vs. field strength audio atten = smd + 1 db read ?fm_softmute? no adjacent channel present -6 -6 10 dbv smd depth -30 -15 0 db smtauatt field strength lpf cut-off frequency for soft mute activation 0.1 100 4000 hz smtaurel field strength lpf cut-off frequency for soft mute release 0.1 1 4000 hz
TDA7703 weak signal processing rev 1 25/32 5.1.3 adjacent channel mute 5.1.4 stereo blend table 21. adjacent channel mute (continuous set) symbol parameter test condition min typ max units acmd depth smd 0 0 db table 22. stereo blend (continuous set) symbol parameter test condition min typ max units maxsep maximum stereo separation field strength = 80 dbv, pilot deviation = 6.75 khz 04050db sbfssp start point vs. field strength separation = maxsep - 1 db no multipath present 20 50 60 dbv sbfsep end point vs. field strength separation = 1 db no multipath present 20 30 60 dbv sbfstm2s field strength-related transition time from mono to stereo v rf step-like variation from 20 dbv to 80 dbv 0.001 3 20 s sbfsts2m field strength-related transition time from stereo to mono v rf step-like variation from 80 dbv to 20 dbv 0.001 0.5 20 s sbmpsp start point vs. multipath separation = maxsep - 1 db equivalent 19 khz am modulation depth; field strength = 80 dbv 51080% sbmpep end point vs. multipath separation = 1 db equivalent 19 khz am modulation depth; field strength = 80 dbv 53080% sbmptm2s multipath -related transition time from mono to stereo v rf step-like variation from 20 dbv to 80 dbv 0.001 1 20 s sbmpts2m multipath -related transition time from stereo to mono v rf step-like variation from 80 dbv to 20 dbv 0.001 0.001 20 s pil thrm2s pilot detector stereo threshold threshold on pilot tone deviation for mono-stereo transition 0.8 2.74 7 khz pil thrhyst pilot detector threshold hysteresis difference in pil. det. deviation threshold for stereo to mono transition compared to pilthrm2s - 0.01 - khz
weak signal processing TDA7703 26/32 rev 1 5.1.5 high cut control table 23. high cut control (continuous set) symbol parameter test condition min typ max units hcfssp start point vs. field strength minimum rf level for widest hc filter (filter # 7) no multipath present 05050dbv hcfsep end point vs. field strength maximum rf level for narrowest hc filter (filter # 0) no multipath present 03040dbv hcfstw2n field strength-related transition time from wide to narrow band v rf step-like variation from 60 dbv to 10 dbv (1) - hcfstn2w field strength-related transition time from narrow to wide band v rf step-like variation from 0 dbv to 60 dbv (1) 14 100 s hcmpsp start point vs. multipath minimum rf level for widest hc filter (filter # 7) equivalent 19 khz am modulation depth; field strength = 80 dbv 5 10 150 (2) % hcmpep end point vs. multipath maximum rf level for narrowest hc filter (filter # 0) equivalent 19 khz am modulation depth; field strength = 80 dbv 5 30 150 (2) % hcmptn2w multipath -related transition time from narrow to wide band v rf step-like variation from 20 dbv to 80 dbv 0.001 0.001 20 s hcmptw2n multipath -related transition time from wide to narrow v rf step-like variation from 80 dbv to 20 dbv 0.001 0.001 20 s hcmaxbw maximum cut-off frequency of high cut filter bank filter #7, -3 db response frequency, input signal with pre-emphasis hcmin bw 14 18 khz hcminbw minimum cut-off frequency of high cut filter bank filter #0, -3 db response frequency, input signal with pre-emphasis 0.1 3 hcma xbw khz hcnumfilt number of discrete hc filters - - 8 (3) -- 1. depends only on field str ength filter time constant. 2. means that 100% equivalent 19 khz am modu lation depth will not achieve full band narrowing. 3. intermediate filters (#6 - #1) cut-off frequencies exponentially spaced between hcmaxbw and hcminbw.
TDA7703 weak signal processing rev 1 27/32 5.1.6 stereo decoder 5.2 am if-processing 5.2.1 channel selection filter 5.2.2 soft mute table 24. de-emphasis filter (continuous set) symbol parameter test condition min typ max units detc de-emphasis time constant 1 - 50 - s de-emphasis time constant 2 - 75 - table 25. stereo decoder symbol parameter test condition min typ max units pilsup pilot signal suppression pilot 9%, 19 khz, ref=40 khz - 60 - db subcsup subcarrier suppression f = 38 khz - 70 - db f = 57 khz - 70 - db f = 76 khz - 80 - db table 26. channel selection filter symbol parameter test condition min typ max units csf bw channel selection filter bw response: - 3db - 3.7 - khz table 27. soft mute (continuous set) symbol parameter test condition min typ max units smsp start point vs. field strength audio atten = 1 db read ?fm_softmute? no adjacent channel present 02540dbv smep end point vs. field strength audio atten = smd + 1 db read ?fm_softmute? no adjacent channel present 0 0 30 dbv smd depth -40 -24 0 db smtauatt transition time for field strength-dependent soft mute activation 0.001 0.1 10 s smtaurel transition time for field strength-dependent soft mute release 0.001 3 10 s
weak signal processing TDA7703 28/32 rev 1 5.2.3 high cut control table 28. high cut control (continuous set) symbol parameter test condition min typ max units hcfssp start point vs. field strength minimum rf level for widest hc filter (filter # 7) no multipath present 04050dbv hcfsep end point vs. field strength maximum rf level for narrowest hc filter (filter # 0) no multipath present 03050dbv hcfstw2n field strength-related transition time from wide to narrow band v rf step-like variation from 60 dbv to 10 dbv 0.001 0.2 20 s hcfstn2w field strength-related transition time from narrow to wide band v rf step-like variation from 0 dbv to 60 dbv 0.001 10 20 s hcnumfilt number of discrete hc filters - 8 - -
TDA7703 application schematic rev 1 29/32 6 application schematic figure 9. typical application schematic ndk5032 or l1, l11,l12,l14 : tdk mmz1608y152c murata blm18he152sn1d notes: llq2012-fr12 llq2012-fr18 toko toko mlz2012a1r0p tdk c41 c32 l17 c30 c37 l9 l5 c33 c13 d5 r13 c35 c40 c3 c24 r10 c7 l10 c5 c42 c45 r7 c4 l8 r9 c25 c14 c44 c22 l6 c18 l11 l1 d4 c8 c6 c11 c38 c15 c36 c21 c26 c34 c43 c46 r1 c20 c23 c16 c47 r8 r5 c1 r4 r2 r3 r6 xtal l7 l12 l14 c10 c12 r11 r12 r14 r15 r15 r15 r15 c39 c19 c2 scl sda_mosi grf grf ant gnd grf gnd grf grf grf grf gnd gnd gnd dgnd vcdig dgnd dgnd dgnd gnd rstn busset vdig vif dacout_r dacout_l dac_gnd gnd dgnd dgnd vrf grf 470nf 10nf 1uh 10nf 1uf 4u7 120n 470pf 100nf kp2311e 1k 100nf 1uf 220nf 22pf 680 220nf 33uh 100nf 150pf 10nf 4700p 100nf 15uh 1 lf1 2 tcagcfm 3 fmmixdec 4 fmmixin 13 lnadec 32 gnd-1v2 44 gnd-vco 43 vcc-vco 42 gnd-pll 41 vcc-pll 40 vcc-ifadc 39 gnd-ifadc 38 dacoutr 37 dacoutl 36 gnd-dac 35 oscin 34 oscout 33 vcc-dac 5 gnd-rf 6 fmpindrv 7 vcc-rf 8 tcam 9 pinddec 10 pindin 11 gnd-lna 12 lnain 14 lnaout 15 lnain2 16 lnaout2 17 lnadec2 18 ammixin2 19 vref165 20 vrefdec 21 gnd-dig 22 vcc-dig 23 vccreg12 24 reg-1v2 25 vdd-3v3 31 vdd-1v2 30 rstn 29 busset 28 vdd-1v2 27 scl 26 sda TDA7703 1.5k 39pf 1uf 82pf 100nf 180n 10nf kp2311e 4.7nf 100nf 10p 100nf 1uf 1uf 2.2uf 1uf 1uf 100nf 1uf 82r 100nf 5pf 3p 10nf 220 220 1uf 2.2k 82r 82r 100 37.05mhz 2u7 1nf 1nf 10r 4r7 4r7 4r7 220nf 10n 33nf
package information TDA7703 30/32 rev 1 7 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. lqfp44 (10x10x1.4mm) mechanical data and package dimensions outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 1.60 0.063 a1 0.05 0.15 0.002 0.006 a2 1.35 1.40 1.45 0.053 0.055 0.057 b 0.30 0.37 0.45 0.012 0.015 0.018 c 0.09 0.20 0.004 0.008 d 11.80 12.00 12.20 0.464 0.472 0.480 d1 9.80 10.00 10.20 0.386 0.394 0.401 d3 8.00 0.315 e 11.80 12.00 12.20 0.464 0.472 0.480 e1 9.80 10.00 10.20 0.386 0.394 0.401 e3 8.00 0.315 e0.80 0.031 l 0.45 0.60 0.75 0.018 0.024 0.030 l1 1.00 0.039 k 0?(min.), 3.5?(typ.), 7?(max.) ccc 0.10 0.0039 lqfp44 (10 x 10 x 1.4mm) 0076922 e
TDA7703 revision history rev 1 31/32 8 revision history table 29. document revision history date revision changes 24-apr-2009 1 initial release.
TDA7703 32/32 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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